CINDAS MPMD

The Microelectronics Packaging Materials Database (MPMD) contains data on thermal, mechanical, electrical and physical properties of electronics packaging materials. This database which contains properties of over 750 materials and contains over 15,000 data curves was developed under the sponsorship of the Semiconductor Research Corporation. The database is searchable by material group, material name, property group, property name and independent variable. For all data curves, the material composition, experimental conditions, raw or smoothed data, and references are given. These references may be to published literature, theses, or technical and laboratory reports. Dynamic graphing capabilities allow users to compare the same property of multiple materials or the same material under different conditions, as well as change the ranges on the graph axes.

The database is produced by CINDAS LLC. For more than 45 years, the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) at Purdue University has managed a comprehensive and systematic research program on the properties and behavior of materials. This research program involves basic and applied research, using both experimental techniques and data from relevant worldwide scientific and technical literature. The end result is the compilation, critical evaluation, correlation, and synthesis of both existing and new experimental data to produce reliable reference data (recommended values), as well as the generation of estimated values to fill data gaps. CINDAS also produces a "companion" database to MPMD: the Thermophysical Properties of Matter Databases (TPMD).

On CSA Illumina, MPMD can be searched as a stand alone file or, alternatively, it can be accessed via a search of CSA databases that contain related materials science records, such as the CSA Technology Research Database.

• Elements
• Metal Alloys
• Solders - Leaded
• Solders - Lead Free
• Intermetallics, Miscellaneous
• Intermetallics, Aluminides
• Intermetallics, Beryllides
• Intermetallics, Silicides
• Ceramics - Oxides
• Ceramics - High K Oxides
• Ceramics - Nitrides, Silicides, Carbides,...
• Molding Compounds
• Encapsulants and Underfill Materials
• Adhesives
• Coating and Unfilled Epoxies
• Polymers - Polyimides
• Polymers - Others
• Composites - Thermal Management
• Composites - Laminates
• Semiconductors
• Liquids & Gases

Thermophysical Properties:

• Coefficient of Thermal Expansion
• Coefficient of Thermal Expansion (Z)
• Contact Angle
• Cross-Linking Density
• Cure Degree
• Cure Temperature
• Curie Temperature
• Density
• Glass transition Temp (Master Curve)
• Glass Transition Temperature
• Interfacial Tension
• Liquide Temperature
• Mean Coeff. of Thermal Expansion
• Mean Coeff. of Thermal Expansion (Z)
• Molar Heat capacity
• Reflectance
• Relative Density
• Softening Temperature
• Solidus Temperature
• Specific Heat Capacity
• Surface Tension
• Thermal Conductivity
• Thermal Conductivity Film
• Thermal expansion
• Thermal Expansion (Z)
• Thermal Expansion Percent
• Thermal Impedance
• Thermal Resistance
• Thermal Resistance Junction – Heat Sink
• Viscosity

Electrical Properties:

• Attenuation
• Coefficient of Electrical Resistivity
• Dielectric Constant
• Dielectric Loss Index
• Dissipation Factor
• Electrical Conductivity
• Electrical Resistivity
• Electrical Resistivity, Film
• Electrical Resistivity, ohm m
• Insulation Resistance
• Leekage Conductance
• Permittivity
• Piezoelectric Constant
• Piezoresistance Coefficient
• Relative Electrical Resistance
• Seebeck Coefficient
• Surface Resistivity
• Volume Resistivity

Mechanical Properties – Modulus:

• Bulk ModulusGPa
• Bulk Modulus, MPa
• Compressive Modulus, GPa
• Compressive Modulus, MPA
• Dynamic Shear Modulus
• Dynamic Young’s Modulus
• Elastic Modulus (out-of-Plane)
• Flexural Modulus
• Flexural Modulus, MPa
• Loss Modulus
• Relaxation Modulus
• Relaxation Modulus (master Curve)
• Young’s Modulus, GPa
• Young’s Modulus, MPa

Mechanical Properties – Strength:

• Bend Strength
• Biaxial Flexural Strength, Ultimate
• Compressive Strength, Yield
• Die Shear Strength
• Flexural Strength
• Fracture Strength
• Lap Shear Strength
• Shear Strength
• Shear Strength, Yield
• Tensile Strength, Break
• Tensile Strength, Ultimate
• Tensile Strength, Yield
• Yield Strength, Flexural

Mechanical Properties – Stress:

• Biaxial Stress
• Biaxial Stress, Yield
• Compressive Lower Yield Stress
• Compressive Stress
• Compressive Stress, True
• Critical Resolved Shear Stress
• Cure Stress
• Elastic Flexural Limit
• Film Stress
• Flexural Stress
• Flow Stress
• Residual Stress
• Shear Stress
• Stress Relaxation
• Tensile Stress
• Tensile Stress, True
• Tensile Upper Yield Stress
• Thermal Stress
• Transverse Rupture Stress

Mechanical Properties – Hardness:

• Brinell hardness
• Knoop Hardness
• Microhardness
• Rockwell A Hardness
• Rockwell hardness
• Shore hardness
• Vickers Hardness
• Vickers Hardness, HV

Mechanical Properties – Fatigue:

• Fatigue Life
• Fatigue Stress
• Fatigue, Bend Strain Range
• Fatigue, Load Drop
• Fatigue, Maximum Stress
• Fatigue Shear Strain Range
• Fatique Shear Stress Range
• Fatigue, Stress Amplitude
• Fatigue, Stress Amplitude Change
• Plastic Strain Range

Mechanical Properties – Creep:

• Compressive Creep Strain, True
• Creep Compliance
• Creep Life
• Creep Plastic Strain
• Creep Rate, Compressive
• Creep Rate, Flexural
• Creep Rate Tensile
• Creep Strain
• Creep Strain Rate
• Creep Strain Rate, True
• Creep Strain, Compressive
• Creep Strain, Tensile
• Creep Strrain, True
• Creep Strength, Tensile
• Creep, Applied Stress
• Creep, Normalized Shear Strain Rate

Optical Properties:

• Absorbance
• Birefringence
• Extiction Coefficient
• Normal Spectral Emissivity
• Normal Total Emissivity
• Refractive Index

Mechanical Properties – Other:

• Adhesion
• Adhesion Strength
• Biaxial Strain
• Burst Pressure
• Compressibility
• Compressive Plastic Deformation
• Compressive Strain
• Compressive Strain at Fracture
• Crack Growth rate
• Crack Growth Rate (da/dn)
• Crack Length
• Elongation
• Elongation at Break
• Elongation at Yield
• Film Strain
• Flexural Strain at Fracture
• Fracture Energy
• Fracture Toughness, K(lc)
• Impact Energy
• Load
• Loss tangent (tan delete)
• Mechanical Loss Factor
• Normal Strain
• Peel Strain
• Plastic Strain
• Plastic Strain at Fracture
• Poisson’s Ratio
• Reduction of Area
• Relaxation, Stress Remaining

Other Properties:

• Activation Enthalpy
• Coefficient of Friction
• Composition
• Corrosion Mass Loss
• Cure Schedule
• Cure Time
• Diffusion Distance
• Diffusion Energy, Grain Boundary
• Dissolution of Nickel
• EMMI Spiral Flow
• Failure Probability
• Film Thickness
• Film Thickness Retention
• Flow Time
• Gel Time
• Grain Size
• Intermetallic Grain Radius
• Intermetallic Grains Density
• Intermetallic Thickness
• Intermetallic Total Grains Volume
• Lifetime
• Linear Shrinkage
• Linear Swelling
• Mass Diffusion Coefficient
• Moisture Content
• Molding Time
• Oxidation Rate
• Oxide Thickness
• Pore Size

15,000+ data curves (as of June 2006)

Quarterly

1900's to present

CINDAS LLC
P.O. Box 3814
West Lafayette, IN 47996-3814
USA
Voice: 800 696 7549 (in N. America)
Voice: +1 765 746 2039 (worldwide)
 

Field Codes

IA = Independent Variable

MG = Material Group

ML = Material

PP = Property

PZ = Property Group