Taiwanese IC Packaging & Testing Industry, 1Q 2017

 Published On: Mar, 2017 |    No of Pages: 16 |  Published By: Market Intelligence center | Format: PDF
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Taiwanese IC Packaging & Testing Industry, 1Q 2017

Executive Summary:

The report finds that shipment value of the Taiwanese IC packaging and testing industry continued to grow sequentially and year-on-year to approximately US$3.55 billion in the fourth quarter of 2016. This was mainly attributed to growing demand for chips found in variety of applications such as IoT microcontrollers, smart car sensors, and graphic cards, virtual reality headsets, and wearable devices. With shipment value of USD 13.0 billion,  Taiwan's global share is estaimated at 53.6%, making it the world's largest fabless IC industry.


Table of Contents:
Taiwanese IC Packaging and Testing Industry Shipment Value, 3Q 2014 - 2Q 2017
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 3Q 2014 - 2Q 2017
Taiwanese IC Packaging Industry Shipment Value , 3Q 2014 - 2Q 2017
Taiwanese IC Testing Industry Shipment Value , 3Q 2014 - 2Q 2017
Taiwanese IC Packaging Industry's Shipment Value Rankings, 3Q 2014 - 4Q 2016
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 3Q 2014 - 4Q 2016
Taiwanese IC Testing Industry's Shipment Value Rankings, 3Q 2014 - 4Q 2016
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 3Q 2014 - 4Q 2016
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 3Q 2014 - 4Q 2016
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 3Q 2014 - 4Q 2016
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 3Q 2014 - 4Q 2016
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 3Q 2014 - 4Q 2016
Exchange Rate, 3Q 2014 - 4Q 2016
Research Scope & Definitions

List of Topics
1. This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
2. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
3. The content of this report is based on primary data obtained from interviews, and publicly available information.


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