3D IC and 2.5D IC Packaging Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022

 Published On: Jan, 2017 |    No of Pages: 175 |  Published By: MarketsandMarkets | Format: PDF
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3D IC and 2.5D IC packaging market is projected to grow at a CAGR of 38.30% between 2016 and 2022

The 3D IC and 2.5D IC packaging market has entered the growth phase and is expected to grow further in the coming years. The market is expected to be worth USD 170.46 billion in 2022, at a CAGR of 38.30% between 2016 and 2022. The drivers for this market are the increasing need for advanced architecture in electronic products, rising trend of miniaturization of electronic devices, and growing market for tablets, smartphones, and gaming devices. The main restraint for this market is created by the thermal issues caused by higher levels of integration.

3D TSV in 3D IC and 2.5D IC packaging market is estimated to grow at the highest CAGR during the forecast period

The 3D TSV market is expected to grow at the highest CAGR during the forecast period. The major factors driving the 3D IC and 2.5D IC packaging market for 3D TSV include highest interconnect density and greater space efficiencies in 3D TSV compared to all other types of advanced packaging such as 3D WLCSP and 2.5 D.

Logic market held the largest share of the 3D IC and 2.5D IC packaging market in 2015

The demand for 3D IC and 2.5D IC packages in logic is growing because of the high product availability. An increasing number of manufacturers in this market offer innovative products with advanced packaging. For instance, Intel Corp. (U.S.) is driving the market for advanced packaging in field programmable gate arrays (FPGA). Global companies started introducing 3D logic ICs in different programmable logics to ensure operational efficiency with added convenience and increased productivity.

APAC is expected to be the fastest-growing market for 3D IC and 2.5D IC packaging during the forecast period

The market in APAC is expected to grow at the highest CAGR because there is a high demand for 3D IC and 2.5D IC packaging technology from the growing consumer electronics sector in this region, particularly for smartphones and tablets. The presence of major 3D IC and 2.5D IC packaging manufacturers and suppliers in this region helps to decrease the time to market for 3D IC and 2.5D IC packaging products. This makes the integration of 3D IC and 2.5D IC packaging technology in the APAC region much easier.  

Breakdown of profile of primary participants:

• By Company: Tier 1 - 45 %, Tier 2 - 32%, and Tier 3 - 23%
• By Designation: C-Level Executives - 25%, Directors - 32%, and Others - 43%
• By Region: North America - 25%, Europe - 37%, APAC - 28%, and RoW - 10%

The major players profiled in this report include:

• Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
• Samsung Electronics Co., Ltd. (South Korea)
• Toshiba Corp. (Japan)
• Pure Storage Inc. (U.S.)
• ASE Group (Taiwan)
• Amkor Technology (U.S.)
• United Microelectronics Corp. (Taiwan)
• STMicroelectronics NV (Switzerland)
• Broadcom Ltd. (Singapore)
• Intel Corporation. (U.S.)
• Jiangsu Changing Electronics Technology Co., Ltd. (China)

Research Coverage

The study segments in the 3D IC and 2.5D IC packages market report are packaging technology which includes 3D wafer-level chip-scale packaging (WLCSP), 3D TSV, and 2.5D; application which includes logic, imaging and optoelectronics, memory, MEMS/sensors, LED, power, analog and mixed signal, RF, and photonics. The study also covers end-user industry and geographic forecast of the market size for various segments with regard to four main regions, namely, Asia-Pacific, North America, Europe, and RoW.

Reasons to buy the report

The report would help the market leaders/new entrants in this market in the following ways:

1. This report segments the 3D IC and 2.5D IC packages market comprehensively and provides the closest approximations of the overall market size and those of the subsegments across different applications and regions.
2. The report helps stakeholders to understand the pulse of the market and provides them information on key market drivers, restraints, challenges, and opportunities.
3. This report would help stakeholders to understand their competitors better and gain more insights to enhance their position in the business. The competitive landscape section includes competitor ecosystem, new product developments, partnerships, and mergers and acquisitions in the market.
TABLE OF CONTENTS

1 INTRODUCTION 15
1.1 OBJECTIVES OF THE STUDY 15
1.2 MARKET DEFINITION 15
1.3 STUDY SCOPE 16
1.3.1 MARKETS COVERED 16
1.3.2 YEARS CONSIDERED FOR THE STUDY 16
1.4 CURRENCY 17
1.5 LIMITATIONS 17
1.6 STAKEHOLDERS 17

2 RESEARCH METHODOLOGY 18
2.1 RESEARCH DATA 18
2.1.1 SECONDARY DATA 19
2.1.1.1 List of major secondary sources 19
2.1.1.2 Key data from secondary sources 20
2.1.2 PRIMARY DATA 21
2.1.2.1 KEY DATA FROM PRIMARY SOURCES 21
2.1.2.2 Breakdown of primaries 22
2.1.3 SECONDARY AND PRIMARY RESEARCH 22
2.1.3.1 Key industry insights 23
2.2 MARKET SIZE ESTIMATION 23
2.3 BOTTOM-UP APPROACH 24
2.4 APPROACH FOR CAPTURING THE MARKET SHARE BY BOTTOM-UP ANALYSIS (DEMAND SIDE) 24
2.5 TOP-DOWN APPROACH 25
2.5.1 APPROACH FOR CAPTURING THE MARKET SHARE BY TOP-DOWN ANALYSIS (SUPPLY SIDE) 25
2.6 MARKET BREAKDOWN AND DATA TRIANGULATION 27
2.7 RESEARCH ASSUMPTIONS 28

3 EXECUTIVE SUMMARY 29

4 PREMIUM INSIGHTS 34
4.1 3D IC AND 2.5D IC PACKAGING MARKET OPPORTUNITIES 34
4.2 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY APPLICATION, BY END-USER INDUSTRY 34
4.3 CONSUMER ELECTRONICS 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY 35
4.4 GEOGRAPHIC SNAPSHOT OF THE 3D IC AND 2.5D IC PACKAGING MARKET 36
4.5 3D IC AND 2.5D IC PACKAGING MARKET IN APAC, BY COUNTRY 36

5 MARKET OVERVIEW 37
5.1 INTRODUCTION 38
5.2 MARKET SEGMENTATION 38
5.2.1 BY PACKAGING TECHNOLOGY 38
5.2.2 BY APPLICATION 38
5.2.3 BY END-USER INDUSTRY 39
5.2.4 BY REGION 40
5.3 MARKET DYNAMICS 41
5.3.1 DRIVERS 42
5.3.1.1 Increasing need for advanced architecture in electronic products 42
5.3.1.2 Rising trend of miniaturization of electronics devices 42
5.3.1.3 Growing market for smartphones, tablets, and gaming devices 42
5.3.2 RESTRAINTS 43
5.3.2.1 Higher level of integration results in thermal issues 43
5.3.2.2 High unit cost of 3D IC and 2.5D IC packages 43
5.3.3 OPPORTUNITIES 44
5.3.3.1 Growing adoption of high-end computing, servers, and data centers 44
5.3.4 CHALLENGES 44
5.3.4.1 Effective supply chain management 44

6 INDUSTRY TRENDS 45
6.1 INTRODUCTION 45
6.2 SUPPLY CHAIN ANALYSIS 45
6.3 TECHNOLOGY TRENDS 48
6.4 PORTER’S FIVE FORCES ANALYSIS 49
6.4.1 THREAT OF NEW ENTRANTS 50
6.4.2 THREAT 0F SUBSTITUTES 52
6.4.3 BARGAINING POWER OF BUYERS 53
6.4.4 BARGAINING POWER OF SUPPLIERS 54
6.4.5 INTENSITY OF COMPETITIVE RIVALRY 55

7 MARKET, BY PACKAGING TECHNOLOGY 56
7.1 INTRODUCTION 57
7.2 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP) 59
7.3 3D TSV 60
7.4 2.5D 61

8 MARKET, BY APPLICATION 62
8.1 INTRODUCTION 63
8.2 LOGIC 65
8.3 IMAGING & OPTOELECTRONICS 66
8.4 MEMORY 68
8.5 MEMS/SENSORS 69
8.6 LED 70
8.7 POWER, ANALOG & MIXED SIGNAL, RF, PHOTONICS 71

9 MARKET, BY END-USER INDUSTRY 73
9.1 INTRODUCTION 74
9.2 CONSUMER ELECTRONICS 76
9.3 TELECOMMUNICATION 78
9.4 INDUSTRIAL SECTOR 81
9.5 AUTOMOTIVE 83
9.6 MILITARY & AEROSPACE 86
9.7 SMART TECHNOLOGIES 89
9.8 MEDICAL DEVICES 92

10 GEOGRAPHIC ANALYSIS 95
10.1 INTRODUCTION 96
10.2 APAC 97
10.2.1 CHINA 98
10.2.2 JAPAN 98
10.2.3 TAIWAN 99
10.2.4 SOUTH KOREA 99
10.2.5 REST OF APAC 99
10.3 NORTH AMERICA 107
10.3.1 U.S. 109
10.3.2 CANADA 109
10.3.3 MEXICO 110
10.4 EUROPE 116
10.4.1 U.K. 118
10.4.2 GERMANY 118
10.4.3 FRANCE 118
10.4.4 REST OF EUROPE 119
10.5 REST OF THE WORLD 124
10.5.1 MIDDLE EAST & AFRICA 125
10.5.2 SOUTH AMERICA 125

11 COMPETITIVE LANDSCAPE 132
11.1 OVERVIEW 132
11.2 KEY PLAYERS IN THE 3D IC AND 2.5D IC PACKAGING MARKET 134
11.3 COMPETITIVE SITUATIONS AND TRENDS 135
11.3.1 PARTNERSHIPS, AGREEMENTS, JOINT VENTURES, AND COLLABORATIONS 135
11.3.2 NEW PRODUCT LAUNCHES AND DEVELOPMENTS 136
11.3.3 INVESTMENTS AND EXPANSIONS 137
11.3.4 ACQUISITIONS 138

12 COMPANY PROFILES 139
12.1 INTRODUCTION 139 (Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, Ratio Analysis, MnM View)*
12.2 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TAIWAN) 140
12.3 SAMSUNG ELECTRONICS CO., LTD. (SOUTH KOREA) 143
12.4 TOSHIBA CORP. (JAPAN) 146
12.5 ASE GROUP (TAIWAN) 149
12.6 AMKOR TECHNOLOGY (U.S.) 152
12.7 UNITED MICROELECTRONICS CORP. (TAIWAN) 155
12.8 STMICROELECTRONICS NV (SWITZERLAND). 157
12.9 BROADCOM LTD. (SINGAPORE) 159
12.10 INTEL CORPORATION. (U.S.) 161
12.11 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD (CHINA) 163

*Details on Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View might not be captured in case of unlisted companies.

13 APPENDIX 165
13.1 INSIGHTS OF INDUSTRY EXPERTS 165
13.2 QUESTIONNAIRE 166
13.3 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 168
13.4 INTRODUCING RT: REAL TIME MARKET INTELLIGENCE 170
13.5 AVAILABLE CUSTOMIZATIONS 172
13.6 RELATED REPORT 172
13.7 AUTHOR DETAILS 173

LIST OF TABLES

TABLE 1 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2013–2022 (USD MILLION) 58
TABLE 2 3D IC AND 2.5D IC PACKAGING MARKET FOR 3D WLCSP, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 59
TABLE 3 3D IC AND 2.5D IC PACKAGING MARKET FOR 3D TSV, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 60
TABLE 4 3D IC AND 2.5D IC PACKAGING MARKET FOR 2.5D, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 61
TABLE 5 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2013–2022 (USD MILLION) 64
TABLE 6 3D IC AND 2.5D IC WAFER (12” EQ.) MARKET, BY APPLICATION, 2013–2022 (THOUSAND UNITS) 65
TABLE 7 3D IC AND 2.5D IC PACKAGING MARKET FOR LOGIC APPLICATION, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 66
TABLE 8 3D IC AND 2.5D IC PACKAGING MARKET FOR IMAGING & OPTOELECTRONICS APPLICATION, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 67
TABLE 9 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 68
TABLE 10 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMS/SENSORS, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 69
TABLE 11 3D IC AND 2.5D IC PACKAGING MARKET FOR LED, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 71
TABLE 12 3D IC AND 2.5D IC PACKAGING MARKET FOR POWER, ANALOG & MIXED SIGNAL, RF, PHOTONICS, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 72
TABLE 13 3D IC AND 2.5D IC PACKAGING MARKET, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 75
TABLE 14 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY APPLICATION, 2013–2022 (USD MILLION) 76
TABLE 15 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY PACKAGING TECHNOLOGY, 2013–2022 (USD MILLION) 77
TABLE 16 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2013–2022 (USD MILLION) 77
TABLE 17 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION, BY APPLICATION, 2013–2022 (USD MILLION) 79
TABLE 18 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION, BY PACKAGING TECHNOLOGY, 2013–2022 (USD MILLION) 79
TABLE 19 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION, BY REGION, 2013–2022 (USD MILLION) 80
TABLE 20 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR, BY APPLICATION, 2013–2022 (USD MILLION) 82
TABLE 21 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR, BY PACKAGING TECHNOLOGY, 2013–2022 (USD MILLION) 82
TABLE 22 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR, BY REGION, 2013–2022 (USD MILLION) 83
TABLE 23 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE, BY APPLICATION, 2013–2022 (USD MILLION) 84
TABLE 24 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE, BY PACKAGING TECHNOLOGY, 2013–2022 (USD MILLION) 85
TABLE 25 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE, BY REGION, 2013–2022 (USD MILLION) 86
TABLE 26 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE, BY APPLICATION, 2013–2022 (USD MILLION) 87
TABLE 27 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE, BY PACKAGING TECHNOLOGY, 2013–2022 (USD MILLION) 87
TABLE 28 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE, BY REGION, 2013–2022 (USD MILLION) 88
TABLE 29 3D IC AND 2.5D IC PACKAGING MARKET FO R SMART TECHNOLOGIES, BY APPLICATION, 2013–2022 (USD MILLION) 90
TABLE 30 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES, BY PACKAGING TECHNOLOGY, 2013–2022 (USD MILLION) 90
TABLE 31 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES, BY REGION, 2013–2022 (USD MILLION) 91
TABLE 32 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES, BY APPLICATION, 2013–2022 (USD MILLION) 92
TABLE 33 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES, BY PACKAGING TECHNOLOGY, 2013–2022 (USD MILLION) 93
TABLE 34 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES, BY REGION, 2013–2022 (USD MILLION) 94
TABLE 35 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2013–2022 (USD MILLION) 97
TABLE 36 3D IC AND 2.5D IC PACKAGING MARKET IN APAC, BY COUNTRY, 2013–2022 (USD MILLION) 100
TABLE 37 3D IC AND 2.5D IC PACKAGING MARKET IN APAC, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 100
TABLE 38 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS IN APAC, BY COUNTRY, 2013–2022 (USD MILLION) 101
TABLE 39 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN APAC, BY COUNTRY, 2013–2022 (USD MILLION) 102
TABLE 40 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN APAC, BY COUNTRY, 2013–2022 (USD MILLION) 103
TABLE 41 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE IN APAC, BY COUNTRY, 2013–2022 (USD MILLION) 103
TABLE 42 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN APAC, BY COUNTRY, 2013–2022 (USD MILLION) 104
TABLE 43 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN APAC, BY COUNTRY, 2013–2022 (USD MILLION) 105
TABLE 44 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN APAC, BY COUNTRY, 2013–2022 (USD MILLION) 105
TABLE 45 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013–2022 (USD MILLION) 108
TABLE 46 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 109
TABLE 47 CONSUMER ELECTRONICS 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013–2022 (USD MILLION) 110
TABLE 48 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN NORTH AMERICA, BY COUNTRY, 2013–2022 (USD MILLION) 111
TABLE 49 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN NORTH AMERICA, BY COUNTRY, 2013–2022 (USD MILLION) 112
TABLE 50 AUTOMOTIVE 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013–2022 (USD MILLION) 112
TABLE 51 MILITARY & AEROSPACE 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013–2022 (USD MILLION) 113
TABLE 52 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN CANADA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 114
TABLE 53 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN NORTH AMERICA, BY COUNTRY, 2013–2022 (USD MILLION) 114
TABLE 54 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN NORTH AMERICA, BY COUNTRY, 2013–2022 (USD MILLION) 115
TABLE 55 3D IC AND 2.5D IC PACKAGING MARKET IN EUROPE, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 117
TABLE 56 3D IC AND 2.5D IC PACKAGING MARKET IN EUROPE, BY COUNTRY, 2013–2022 (USD MILLION) 117
TABLE 57 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS IN EUROPE, BY COUNTRY, 2013–2022 (USD MILLION) 119
TABLE 58 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN EUROPE, BY COUNTRY, 2013–2022 (USD MILLION) 120
TABLE 59 3D IC AND 2.5D IC PACKAGING MARKET IN EUROPE FOR INDUSTRIAL SECTOR, BY COUNTRY, 2013–2022 (USD MILLION) 120
TABLE 60 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE IN EUROPE, BY COUNTRY, 2013–2022 (USD MILLION) 121
TABLE 61 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN EUROPE, BY COUNTRY, 2013–2022 (USD MILLION) 122
TABLE 62 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN EUROPE, BY COUNTRY, 2013–2022 (USD MILLION) 123
TABLE 63 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN EUROPE, BY COUNTRY, 2013–2022 (USD MILLION) 123
TABLE 64 3D IC AND 2.5D IC PACKAGING MARKET IN ROW, BY REGION, 2013–2022 (USD MILLION) 125
TABLE 65 3D IC AND 2.5D IC PACKAGING MARKET IN ROW, BY END-USER INDUSTRY, 2013–2022 (USD MILLION) 126
TABLE 66 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS IN ROW, BY REGION, 2013–2022 (USD MILLION) 126
TABLE 67 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN ROW, BY REGION, 2013–2022 (USD MILLION) 127
TABLE 68 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN ROW, BY REGION, 2013–2022 (USD MILLION) 128
TABLE 69 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE IN ROW, BY REGION, 2013–2022 (USD MILLION) 129
TABLE 70 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN ROW, BY REGION, 2013–2022 (USD MILLION) 129
TABLE 71 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN ROW, BY REGION, 2013–2022 (USD MILLION) 130
TABLE 72 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN ROW, BY REGION, 2013–2022 (USD MILLION) 131
TABLE 73 PARTNERSHIPS, AGREEMENTS, JOINT VENTURES, AND COLLABORATIONS (2014–2016) 135
TABLE 74 NEW PRODUCT LAUNCHES AND DEVELOPMENTS (2013–2016) 136
TABLE 75 INVESTMENTS AND EXPANSIONS (2013–2016) 137
TABLE 76 ACQUISITIONS (2015–2016) 138

LIST OF FIGURES

FIGURE 1 3D IC AND 2.5D IC PACKAGING MARKET SEGMENTATION 16
FIGURE 2 3D IC AND 2.5D IC PACKAGING MARKET: RESEARCH DESIGN 18
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 25
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 26
FIGURE 5 DATA TRIANGULATION 27
FIGURE 6 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY APPLICATION EXPECTED TO GROW AT THE HIGHEST RATE BETWEEN 2016 AND 2022 30
FIGURE 7 MEMORY SHIPMENT MARKET IS EXPECTED TO GROW AT THE HIGHEST CAGR BETWEEN 2016 AND 2022 31
FIGURE 8 MARKET FOR 3D TSV PACKAGING TECHNOLOGY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 31
FIGURE 9 MARKET FOR SMART TECHNOLOGIES INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 32
FIGURE 10 APAC ACCOUNTED FOR THE LARGEST MARKET SHARE IN 2015 33
FIGURE 11 3D IC AND 2.5D IC PACKAGING MARKET TO PROVIDE ATTRACTIVE OPPORTUNITIES DURING THE FORECAST PERIOD 34
FIGURE 12 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY APPLICATION IN AUTOMOTIVE INDUSTRY TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 34
FIGURE 13 MARKET FOR 3D TSV TECHNOLOGY FOR CONSUMER ELECTRONICS INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 35
FIGURE 14 3D IC AND 2.5D IC PACKAGING MARKET IN CHINA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 36
FIGURE 15 CHINESE MARKET EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 36
FIGURE 16 GEOGRAPHIC SEGMENTATION OF THE 3D IC AND 2.5D IC PACKAGING MARKET 40
FIGURE 17 RISING TREND OF MINIATURIZATION OF ELECTRONIC DEVICES IS THE MAJOR DRIVER FOR THE 3D IC AND 2.5D IC PACKAGING MARKET 41
FIGURE 18 SHIPMENTS OF SMARTPHONES WORLDWIDE, 2013–2019 (MILLION UNITS) 43
FIGURE 19 SUPPLY CHAIN: 3D IC AND 2.5D IC PACKAGING MARKET 46
FIGURE 20 KEY TECHNOLOGY TRENDS IN THE 3D IC AND 2.5D IC PACKAGING MARKET 48
FIGURE 21 PORTER’S FIVE FORCES ANALYSIS (2015) 49
FIGURE 22 PORTER’S FIVE FORCES ANALYSIS FOR THE 3D IC AND 2.5D IC PACKAGING MARKET, 2015 50
FIGURE 23 IMPACT OF THREAT OF NEW ENTRANTS CONSIDERED TO BE LOW 50
FIGURE 24 IMPACT OF THREAT OF SUBSTITUTES CONSIDERED TO BE MEDIUM 52
FIGURE 25 IMPACT OF BARGAINING POWER OF BUYERS CONSIDERED TO BE MEDIUM 53
FIGURE 26 IMPACT OF BARGAINING POWER OF SUPPLIERS CONSIDERED TO BE HIGH 54
FIGURE 27 IMPACT OF INTENSITY OF COMPETITIVE RIVALRY CONSIDERED TO BE MEDIUM 55
FIGURE 28 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY 57
FIGURE 29 MARKET FOR 3D TSV EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 58
FIGURE 30 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION 63
FIGURE 31 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 63
FIGURE 32 MARKET FOR IMAGING & OPTOELECTRONICS IN AUTOMOTIVE INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 67
FIGURE 33 MARKET FOR LED IN SMART TECHNOLOGIES INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 70
FIGURE 34 3D IC AND 2.5D IC PACKAGING MARKET, BY END-USER INDUSTRY 74
FIGURE 35 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD 75
FIGURE 36 MARKET FOR MEMORY APPLICATION IN TELECOMMUNICATION INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD 78
FIGURE 37 MARKET FOR TELECOMMUNICATION INDUSTRY IN APAC EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD 80
FIGURE 38 MARKET FOR MEMORY APPLICATION IN INDUSTRIAL SECTOR EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD 81
FIGURE 39 MARKET FOR MEMORY IN AUTOMOTIVE INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD 84
FIGURE 40 MARKET FOR AUTOMOTIVE INDUSTRY IN NORTH AMERICA EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD 85
FIGURE 41 MARKET FOR MILITARY AND AEROSPACE INDUSTRY IN APAC TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD 88
FIGURE 42 MARKET FOR MEMORY APPLICATION IN SMART TECHNOLOGIES EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD 89
FIGURE 43 MARKET FOR 3D TSV IN MEDICAL DEVICES INDUSTRY EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD 93
FIGURE 44 3D IC AND 2.5D IC PACKAGING MARKET IN APAC EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 96
FIGURE 45 APAC: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT 98
FIGURE 46 3D IC AND 2.5D IC PACKAGING MARKET IN CHINA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 99
FIGURE 47 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN CHINE EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD. 102
FIGURE 48 CHINESE 3D IC AND 2.5D IC PACKAGING MARKET IN MILITARY & AEROSPACE EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 104
FIGURE 49 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT 107
FIGURE 50 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA FOR SMART TECHNOLOGIES EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 108
FIGURE 51 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN CANADA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD. 111
FIGURE 52 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT 116
FIGURE 53 3D IC AND 2.5D IC PACKAGING MARKET IN FRANCE EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 119
FIGURE 54 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN FRANCE EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 122
FIGURE 55 ROW: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT 124
FIGURE 56 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN SOUTH AMERICA EXPECTED TO GROW AT A HIGHEST RATE DURING THE FORECAST PERIOD 128
FIGURE 57 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN SOUTH AMERICA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 130
FIGURE 58 COMPANIES ADOPTED NEW PRODUCT LAUNCHES/DEVELOPMENTS AND COLLABORATIONS AS THE KEY GROWTH STRATEGIES BETWEEN 2012–2016 133
FIGURE 59 RANKING ANALYSIS FOR THE TOP 5 PLAYERS IN THE 3D IC AND 2.5D IC PACKAGING MARKET 134
FIGURE 60 BATTLE FOR MARKET SHARE: PARTNERSHIPS, AGREEMENTS, JOINT VENTURES, AND COLLABORATIONS WERE THE KEY STRATEGIES ADOPTED 135
FIGURE 61 GEOGRAPHIC REVENUE MIX OF THE TOP 5 MARKET PLAYERS 139
FIGURE 62 TSMC LTD. (TAIWAN): COMPANY SNAPSHOT 140
FIGURE 63 TSMC LTD. (TAIWAN): SWOT ANALYSIS 142
FIGURE 64 SAMSUNG ELECTRONICS CO., LTD. (SOUTH KOREA): COMPANY SNAPSHOT 143
FIGURE 65 SAMSUNG ELECTRONICS CO., LTD. (SOUTH KOREA): SWOT ANALYSIS 145
FIGURE 66 TOSHIBA CORP. (JAPAN): COMPANY SNAPSHOT 146
FIGURE 67 TOSHIBA CORP. (JAPAN): SWOT ANALYSIS 148
FIGURE 68 ASE GROUP (TAIWAN): COMPANY SNAPSHOT 149
FIGURE 69 ASE GROUP (TAIWAN): COMPANY SNAPSHOT 151
FIGURE 70 AMKOR TECHNOLOGY (U.S.): COMPANY SNAPSHOT 152
FIGURE 71 AMKOT TECHNOLOGY (U.S.): SWOT ANALYSIS 154
FIGURE 72 UNITED MICROELECTRONICS CORP. (TAIWAN): COMPANY SNAPSHOT 155
FIGURE 73 STMICROELECTRONICS NV (SWITZERLAND): BUSINESS OVERVIEW 157
FIGURE 74 BROADCOM LTD (SINGAPORE): COMPANY SNAPSHOT 159
FIGURE 75 INTEL CORPORATION (U.S.): BUSINESS OVERVIEW 161
FIGURE 76 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD. (CHINA): COMPANY SNAPSHOT 163

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