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About Wafer-level Packaging EquipmentICs are very delicate in nature, therefore, prone to contamination that can cause malfunctioning. To eliminate such issues, silicon chips or ICs are protected by using packaging materials. Wafer level packaging is one such type of packaging, which involves the packaging of individual ICs using best fit packaging processes conducted at wafer level manufacturing in semiconductor production process.TechNavio's analysts forecast the Global Wafer-level Packaging Equipment market to grow at a CAGR of 0.1 percent over the period 2014-2019.Covered in this ReportThis report covers the present scenario and the growth prospects of the Global Wafer-level Packaging Equipment market for the period 2015-2019. This report considers 2014 as the base year and provides data for the trailing 12 months. To calculate the market size, the report considers revenue generated from the sales of wafer-level packaging equipment worldwide. However, the report does not take into consideration the following while calculating the market size:• Support or maintenance services that are offered for/with wafer-level packaging equipment• Components that are used in the production of wafer-level packaging equipment• Aftermarket sales of wafer-level packaging equipmentKey Regions• Americas• APAC• EMEAKey Vendors• Applied Materials• Disco• EV Group• Tokyo Electron• Tokyo SeimitsuOther Prominent Vendors • Rudolph Technologies• SEMES• Suss Microtec• Ultratech• ULVACMarket Driver• Increased Demand for Smartphones and Tablets• For a full, detailed list, view our reportMarket Challenge• Rapid Changes in Technology• For a full, detailed list, view our reportMarket Trend• Short Replacement Cycle of Portable Electronic Devices• For a full, detailed list, view our reportKey Questions Answered in this Report• What will the market size be in 2019 and what will the growth rate be?• What are the key market trends?• What is driving this market?• What are the challenges to market growth?• Who are the key vendors in this market space?• What are the market opportunities and threats faced by the key vendors?• What are the strengths and weaknesses of the key vendors?
Table of Contents01. Executive Summary02. List of Abbreviations03. Scope of the Report03.1 Market Overview03.2 Product Offerings04. Market Research Methodology04.1 Market Research Process04.2 Research Methodology05. Introduction06. Industry Overview06.1 Semiconductor Industry Overview06.1.1 Semiconductor Value Chain06.2 Structure of Semiconductor Market06.3 Global Semiconductor Market Overview06.3.1 Geographical Segmentation of Semiconductor Market 2005-201207. Market Landscape07.1 Market Size and Forecast07.2 Five Forces Analysis08. Geographical Segmentation08.1 Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-201908.2 Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (percentage share and revenue split)08.3 Wafer-level Packaging Equipment Market in APAC Region08.3.1 Market Size and Forecast08.4 Wafer-level Packaging Equipment Market in Americas08.4.1 Market Size and Forecast08.5 Wafer-level Packaging Equipment Market in EMEA Region08.5.1 Market Size and Forecast09. Key Leading Countries09.1 Taiwan09.2 South Korea09.3 US10. Buying Criteria11. Market Growth Drivers12. Drivers and their Impact13. Market Challenges14. Impact of Drivers and Challenges15. Market Trends16. Trends and their Impact17. Vendor Landscape17.1 Competitive Scenario17.2 Market Share Analysis 201417.3 Other Prominent Vendors18. Key Vendor Analysis18.1 Applied Materials18.1.1 Key Facts18.1.2 Business Overview18.1.3 Business Segmentation by Revenue 201318.1.4 Business Segmentation by Revenue 2011-201318.1.5 Geographical Segmentation by Revenue 201318.1.6 Business Strategy18.1.7 Recent Developments18.1.8 SWOT Analysis18.2 DISCO18.2.1 Key Facts18.2.2 Business Overview18.2.3 Product Segmentation by Revenue 201318.2.4 Product Segmentation by Revenue 2012 and 201318.2.5 Geographical Segmentation by Revenue 201318.2.6 Business Strategy18.2.7 Recent Developments18.2.8 SWOT Analysis18.3 EV18.3.1 Key Facts18.3.2 Business Overview18.3.3 Product Segmentation 201318.3.4 Recent Developments18.3.5 SWOT Analysis18.4 Tokyo Electron18.4.1 Key Facts18.4.2 Business Overview18.4.3 Business Segmentation by Revenue 201318.4.4 Business Segmentation by Revenue 2011-201318.4.5 Geographical Segmentation by Revenue 201318.4.6 Business Strategy18.4.7 Recent Developments18.4.8 SWOT Analysis18.5 Tokyo Seimitsu18.5.1 Key Facts18.5.2 Business Overview18.5.3 Product Segmentation by Revenue 201318.5.4 Product Segmentation by Revenue 2012 and 201318.5.5 Geographical Segmentation by Revenue 201318.5.6 Business Strategy18.5.7 Recent Developments18.5.8 SWOT Analysis19. Market Summary19.1 Growth Propellers19.1.1 Expansion Plans19.1.2 Replacement of Old Equipment19.2 Growth Inhibitor19.2.1 Cyclic Nature of Semiconductor Industry19.2.2 Rapid Advances in Technology19.3 Ongoing Trends19.3.1 Increasing Number of Innovations19.3.2 Increasing Penetration of Clean Energy Devices19.3.3 Increasing Focus on Improving Production Yield19.3.4 Increasing Adoption of Semiconductors in Automotive Sector19.4 Market Attractiveness20. Other Reports in this SeriesList of ExhibitsExhibit 1: Market Research MethodologyExhibit 2: Semiconductor Value ChainExhibit 3: Front-end ProcessExhibit 4: Back-end ProcessExhibit 5: Structure of Semiconductor MarketExhibit 6: Global Semiconductor Market 2014Exhibit 7: Global Semiconductor Market by Geographical Segmentation 2005-2012Exhibit 8: Global Wafer-level Packaging Equipment Market 2013-2018 (US$ million)Exhibit 9: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014Exhibit 10: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (percentage share)Exhibit 11: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (US$ million)Exhibit 12: Comparison of Geographies by CAGR 2014-2019Exhibit 13: Wafer-level Packaging Equipment Market in Taiwan 2014-2019 (US$ million)Exhibit 14: Wafer-level Packaging Equipment Market in South Korea 2014-2019 (US$ million)Exhibit 15: Wafer-level Packaging Equipment Market in US 2014-2019 (US$ million)Exhibit 16: CAGR Comparison between Key Leading Countries 2014-2019Exhibit 17: Global Smartphone Market by Unit Shipments 2013-2019 (billion units)Exhibit 18: Global Tablets Market by Unit Shipments 2013-2019 (million units)Exhibit 19: Global Wafer-level Packaging Equipment Market by Vendor Ranking 2014Exhibit 20: Applied Materials: Business Segmentation by Revenue 2013Exhibit 21: Applied Materials: Business Segmentation by Revenue 2011-2013 (US$ million)Exhibit 22: Applied Materials: Geographical Segmentation by Revenue 2013Exhibit 23: DISCO: Product Segmentation by Revenue 2013Exhibit 24: DISCO: Product Segmentation by Revenue 2012 and 2013 (US$ million)Exhibit 25: DISCO: Geographical Segmentation by Revenue 2013Exhibit 26: EV: Product Segmentation 2013Exhibit 27: Tokyo Electron: Business Segmentation by Revenue 2013Exhibit 28: Tokyo Electron: Business Segmentation by Revenue 2011-2013 (US$ million)Exhibit 29: Tokyo Electron: Geographical Segmentation by Revenue 2013Exhibit 30: Tokyo Seimitsu: Business Segmentation by Revenue 2013Exhibit 31: Tokyo Seimitsu: Business Segmentation by Revenue 2011-2013 (US$ million)Exhibit 32: Tokyo Seimitsu: Geographical Segmentation by Revenue 2013