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Recap and Outlook of Worldwide IC Packaging and Testing Industry in 2016Executive Summary:The worldwide IC packaging and testing industry, worldwide and Taiwanese companies alike, suffered weak growth momentum in 2015 due to declines in the global PC market and a slowdown in mobile device sales. Despite the new opportunities contributed by non-3C segments such as automobile and IoT (Internet of Things), growth of these segments has remained limited as they are still in the early stages of development. Therefore, 3C products will continue to be a key driving force to fuel growth. In response to changes in the industry, foreign and Taiwanese IC packaging and testing vendors have introduced many new strategies and deployments. This report reviews the business performance of the worldwide IC packaging and testing industry in 2015 and analyzes its development in 2016.
Table of Contents:1. Worldwide IC Packaging and Testing Industry Shipment Value1.1 OSAT Industry Shipment Value Declines in 2015 on Weak Market Demand1.2 Taiwan Boasts Largest Shipment Value Share in 2015, Followed by China2. Leading International Vendors' Development2.1 Amkor Acquires J-Device for Automotive IC Market; UTAC Focuses on Product Diversification2.2 China Eyes on High-end Technology and Turn-key Solutions3. Leading Taiwanese Vendors' Development3.1 ASE Develops Diversified Technologies in Multiple Industries3.2 SPIL Develops SiP with Foxconn; PTI Enhances Deployment in China with Micron4. Conclusion4.1 China's Horizontal Integration Poses Threats to Taiwanese Vendors4.2 Taiwan can Maintain Competitiveness via Horizontal and Vertical IntegrationAppendixGlossary of TermsList of CompaniesList of Topics- Overview of the worldwide IC packaging and testing industry, including OSAT industry's shipment value and share by country from 2014 to 2017- Summary of the development of key players, including Amkor and UTAC, leading Chinese vendorsJiangsu Changjiang Electronics Technology, Tianshui Huatian Technology, and Nantong Fujitsu Microelectronics, as well asleading Taiwanese vendors ASE, SPIL, and PTI; also included are vendors' strategic alliance with upstream wafer foundries in ChinaList of Figures:Figure 1: Worldwide OSAT Industry Shipment Value and Growth Rates, 2014 - 2017Figure 2: OSAT Industry Shipment Value Share by Country, 2014 - 2017Figure 3:Leading International IC Packaging and Testing Vendors' MilestonesFigure 4: Leading Chinese Packaging and Testing Vendors' Acquisition of Advanced Technologies and Provisioning of Turn-key SolutionsFigure 5: ASE's Technology Development and Industrial DeploymentFigure 6: Recent Developments of SPIL and PTI