Plastics in Electronics Components: Technologies and Global Markets
 
Published Date: 01 Nov 2017
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No of Pages: 177
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URL: http://www.bharatbook.com/materials-chemicals-market-research-reports-569159/plastics-in-electronics-components-technologies-global.html

Abstract

The global electronics components market reached nearly 3.9 billion pounds in 2016. This market is estimated to reach nearly 6.1 billion pounds in 2022 from 4.2 billion pounds in 2017 at a compound annual growth rate (CAGR) of 7.7% for 2017-2022.

Report Includes

-An overview of the global market for plastics in electronic components
-Analyses of global market trends, with data from 2016, estimates for 2017, and projections of compound annual growth rates (CAGRs) through 2022
-Information about pricing of resins, molders of electronic components, testing agencies, and requirements related to electronic components
-Coverage of single devices, such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.
-Comprehensive company profiles of major players in the industry

Study Goals and Objectives

This study focuses on the use of plastics in electronics components. It considers the wide range of thermoplastics and thermosetting polymers (including polyurethanes) that are being used in electronics components found in industrial, automotive and consumer electronics. It reviews the most recent developments in these materials that respond to the changing needs of the markets, and it analyzes the current and likely future sizes of these markets, broken down by component and by polymer type.

Reasons for Doing This Study

Plastics consumption in electronics components has been growing at rates well above the growth in gross domestic product for many years. Electronics products have invaded virtually all areas of our personal and business lives, and their levels of sophistication continue to increase. The amount of electronics in automobile control, driver assist and infotainment systems is rising rapidly. Cloud computing is carried out on a massive scale, and now the Internet of Everything is connecting devices as well as people.

At the same time, the tendency of many personal electronics to become fashion items has reduced product life cycles, with each new product generation putting new demands, in performance and especially cost, on the materials that go into them.

In addition, the increasing visibility of electronics devices, most notably in mobile devices (smartphones and tablets), has been a key driver in pushing electronics companies to use more “environment-friendly” technologies and materials in their products. As a result, the market is in a state of permanent flux, and regular reappraisals are called for. This report is a fully revised update of an earlier version prepared in 2015.

Scope of Report

This study covers all electronics components where plastics are used to a significant extent. It concentrates on components produced by injection molding, compression molding and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures.

The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronics components, and it looks at interpolymer competition.

Information Sources

Both primary and secondary Information Sources were used in preparing this report. A comprehensive review was undertaken of literature relating to polymers used to produce electronics components, their applications, and technologies used to produce the components, markets and producers along the supply chain around the world. Included in the review was literature from manufacturers, associations and independent observers. Interviews were also carried out with various experts in the field.

Methodology

Following collection and analysis of information from the literature review, unresolved issues were resolved from other sources, with input from producers, suppliers and fabricators of rigid transparent plastics. Additional details are provided in Chapter 4, Market Breakdown by Technology Type.

Geographic Breakdown

The market projections in this report are for the global market in its entirety.

Table Of Content

Chapter 1: Introduction 1
Study Goals and Objectives 1
Reasons for Doing This Study 1
Scope of Report 1
Information Sources 2
Methodology 2
Geographic Breakdown 2
Analyst's Credentials 5
Related BCC Research Reports 5

Chapter 2: Summary and Highlights 7

Chapter 3: Market and Technology Background 10
Overview 10
Snapshot of the Electronics Device Market 10
Computers 11
Overview 11
Desktops 11
Electronics Displays 12
Background 12
Printers 12
Overview 12
Inkjet Printers 12
Monochrome Laser Printers 12
Color Laser Printers 13
Manufacturers 13
“All-in-One” Machines 13
Phones 13
Corded 13
Cordless 13
Fax Machines 13
Scanners 14
Mobile Electronics Devices 14
Phones 14
Laptops/Notebooks/Netbooks 14
Tablets 15
E-Readers 15
Portable Music Players 15
Automotive Market 16
Overview 16
Electric Cars 16
CAFE Issues 16
Overview of Electronics Components in Automotive Products 17
Material Usage 18
Connectors 18
Sensors 19
Flexible Circuitry in Automotive Applications 20

Chapter 4: Market Breakdown by Technology Type 22
Overview 22
Types of Polymers 22
Thermoplastics 23
Standard Nylons 23
Thermoplastic Polymers 29
Polyphenylene Sulfide 34
Polyimides 38
Polycarbonates 41
Polyphthalamides and Other High-Temperature Nylons 45
Liquid Crystal Polymers 48
Sulfone Polymers 51
Alloys/Blends 53
Fluoropolymers 55
Polyaryletherketones 57
Cyclic Olefin Copolymers 59
Thermoplastic Market Estimates and Forecasts Summary 60
Thermoset Polymers 61
Overview 61
General Properties 61
Epoxy Resins 62
Polyurethanes 67
Phenolics 69
Unsaturated Polyesters 72
Diallyl Phthalate 75
BT-Epoxy Resins and Cyanate Esters 76
Thermoset Market Estimates and Forecasts Summary 77

Chapter 5: Overview of Key Components, PCBs and Encapsulants 79
Introduction 79
Focus of This Report 79
Resin Consumption 80
Background 80
Markets 80
Growth 80
Market Drivers 81
Printed Circuit Boards 81
Overview 81
Property Requirements for Laminates 82
Physical Composition 83
Assembly Technologies 83
PCB Substrates 83
Specific Polymers Used in Printed Circuit Boards 85
Other Materials Used in Printed Circuit Boards 86
Fiber Reinforcements 86
Production of Circuitry 86
Environmental Issues 87
Flexible Printed Circuit Boards 88
Soldering 91
Production Statistics 92
Industry Trends 93
Electronics Packaging 93
Market Estimates and Forecasts 102
Encapsulants 105
Definitions and Background 105
Primary Purposes of Encapsulation 105
Encapsulant Materials 106
Epoxy Encapsulation Formulations 107
Encapsulated Electrical and Electronics Components 108
Epoxy Encapsulant Systems 108
Silicone Encapsulants 109
Thermoplastic Encapsulants 109
Selected Major Encapsulant Producers and Their Product Lines 111
Market Estimates and Forecasts 111

Chapter 6: Molded Electronics Products 114
Overview 114
Background 114
Polymers Used 114
Market Drivers 114
Connectors 115
Background 115
Trends 115
Applications for Electronics Connectors 116
Material Selection 116
Flame Retardance 117
Standards Relating to Connectors 119
Manufacturers 120
End-Use Markets 121
Market Estimates and Forecasts 123
Switches 125
Background 125
Market Estimates and Forecasts 125
Coil Formers 127
Background 127
Manufacturers 127
Market Estimates and Forecasts 128
Relays 130
Background 130
Market Estimates and Forecasts 130
Capacitors 132
Background 132
Applications 132
Capacitor Materials 133
Consumption by Market Segment 134
Market Estimates and Forecasts 134
Other Molded Electronics Components 135
Resistors 135
Market Estimates and Forecasts 136
Summary of Market Estimates and Forecasts 138

Chapter 7: Patent Review/ New Developments... 143
Background 143
Importance of Miniaturization 143
Thin-Walling Electronics Components 144
Background 144
Effects of Thin-Walling on Performance Requirements and Design 144
Application Requirements 144
Material and Process Selection 145
Properties Required 145
Challenges in Downsizing 146
Software that Aids Thin-wall Design 146
Flexible Electronics 146
Overview 146
Wearable Electronics 149
Cloud Computing and Big Data 149
The Internet of Everything 150
Changes in Electronics Component Manufacturing that Could Influence Resin Choices 150
Recent Patents Related to the Industry 151

Chapter 8: Electronics Components Industry Overview and Plastics Producers . 155
Top Semiconductor Producers and Customers 155
Manufacturing and Marketing Aspects 156
Globalization 156
What Component Suppliers Are Doing 156
Plastics Producers 157
Overview 157
Polymer Producers According to Material Type 162
Thermosets 162
Thermoplastics 162

Chapter 9: Environmental Issues 166
Overview 166
Printed Circuit Board Disposal 166
Bromine-Free Printed Circuit Boards 166
Halogen-Free Flame Retardants for Thermoplastics 167
Recycling 167
Electronics Industry Interface 168
Overview 168
Reasons for Increased Environmental Regulations for Electronics Equipment 168
The European Union RoHS Directive 169
The European Union WEEE Directive 170
EPEAT 170

Chapter 10: Performance Requirements Related to Electronics Components 172
Overview 172
Flammability Standards 172
Definitions 172
Flammability Tests 173
Overview 173
UL 94 173
Glow-Wire Flammability Index – IEC 60695 174
UL 1694 174