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Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027

Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027

The thin wafer market is projected to grow from USD 11.4 billion in 2022 and is projected to reach USD 20.6 billion by 2027; it is expected to grow at a CAGR of 12.5% from 2022 to 2027.
Reducing sizes of electronic devices, rising adoption of MEMS technology in portable health monitoring devices, growing smartphone and consumer electronics markets and high amount of material saving is expected to fuel the growth of the thin wafer market.

However, issues related to efficiency maintenance is limiting the growth of the thin wafer market.

“Market for 200 mm wafers to hold a significant share during the forecast period.”

200 mm wafers are expected to witness significant demand majorly on account of their wide adoption in power devices, ICs, LEDs, MEMS, and many other semiconductor and electronic devices. The 200 mm wafers are affordable and can be easily integrated into various devices. As a result, these wafers are adopted on a large-scale basis by small-scale and large-scale electronic manufacturers. Furthermore, for the manufacturing of devices that require small die sizes and have a global shipment size in the thousands, these wafers are increasingly being used. LED, RF device, and power transistors manufacturers use 200 mm silicon wafers.

In May 2022, Soitec (France) has released its first 200mm silicon carbide SmartSiC™ wafer. With the release, Soitec is able to enlarge its SiC product portfolio beyond 150mm, take the development of its SmartSiC™ wafers to the next level and cater to the growing demand of the automotive market.

“Wafer polishing equipment market is expected to grow at the highest CAGR during the forecast period”

The growth of the wafer polishing equipment market can be attributed to the increasing demand for thinner wafers to integrate microelectronics into various consumer electronic devices. The wafer polishing process creates thinner wafers compared to back-grinding alone and evens out any irregular topography and prevents warping that causes the wafers to weaken. Thus, there is an increased demand for wafer polishing equipment. Moreover, the increasing number of semiconductor fabrication plants in countries such as China and Taiwan, owing to growing investments in semiconductor manufacturing, is expected to contribute toward the growth of the wafer thinning equipment market.

“Asia Pacific to hold the largest share of the thin wafer market during the forecast period”

Asia Pacific is expected to hold the largest share of the thin wafer market during the forecast period. The Asia Pacific has witnessed large-scale adoption of smart electronic devices. This has led the consumer electronics manufacturers to launch higher-end devices in this region. The acceptance of the latest technology trends by majority of consumer electronics manufacturers have stimulated the demand for thinner wafers in Asia Pacific.

In recent years, there has been a remarkable increase in the number of semiconductor fabrication plants and IC manufacturing firms in countries such as China and Taiwan, due to investments in semiconductor manufacturing this has paved way towards the growth of the thin wafer market in the Asia Pacific region.
In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key industry experts in the thin wafer space.

The break-up of primary participants for the report has been shown below:
•By Company Type: Tier 1 –40%, Tier 2 – 40%, and Tier 3 – 20%
•By Designation: C-level Executives – 40%, Directors –40%, and Others – 20%
•By Region: Americas –33%, Asia Pacific– 45%, EMEA –22%

The report profiles key players in the thin wafer market with their respective market ranking analysis. Prominent players profiled in this report are include Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), DISCO Corporation (Japan), 3M (US), and Applied Materials (US Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US) are among a few emerging companies in the thin wafer market.

Research Coverage:
This research report categorizes global thin wafer market based on wafer size, process, technology, application and geography. The report describes the major drivers, restraints, challenges, and opportunities pertaining to the thin wafer market and forecasts the same till 2027 (including analysis of COVID-19 impact on the market). Apart from these, the report also consists of leadership mapping and analysis of all the companies included in the thin wafer ecosystem.

Key Benefits of Buying the Report
The report would help leaders/new entrants in this market in the following ways:
1.This report segments the thin wafer market comprehensively and provides the closest market size projection for all subsegments across different regions.
2.The report helps stakeholders understand the pulse of the market and provides them with information on key drivers, restraints, challenges, and opportunities for market growth.
3.This report would help stakeholders understand their competitors better and gain more insights to improve their position in the business. The competitive landscape section includes competitor ecosystem, product developments and launches, partnerships, and mergers and acquisitions.
4.The analysis of the top 28 companies, based on the market rank as well as the product footprint will help stakeholders visualize the market positioning of these key players.
5.Patent analysis, trade data, and technological trends that will shape the market in the coming years has also been covered in this report.
Table of Contents

1INTRODUCTION25
1.1STUDY OBJECTIVES25
1.2MARKET DEFINITION25
1.3STUDY SCOPE26
1.3.1MARKETS COVERED26
1.3.2INCLUSIONS AND EXCLUSIONS26
1.3.3REGIONAL SCOPE27
1.3.4YEARS CONSIDERED27
1.4CURRENCY27
1.5PACKAGE SIZE28
1.6STAKEHOLDERS28
1.7SUMMARY OF CHANGES28
2RESEARCH METHODOLOGY29
2.1RESEARCH DATA29
FIGURE 1THIN WAFER MARKET: RESEARCH DESIGN30
2.1.1SECONDARY DATA30
2.1.1.1Major secondary sources31
2.1.1.2Key data from secondary sources31
2.1.2PRIMARY DATA31
2.1.2.1Primary interviews with experts32
2.1.2.2Breakdown of primaries32
2.1.3SECONDARY AND PRIMARY RESEARCH33
2.1.3.1Key industry insights33
2.2MARKET SIZE ESTIMATION34
FIGURE 2MARKET SIZE ESTIMATION METHODOLOGY: REVENUE GENERATED BY KEY PLAYERS IN THIN WAFER MARKET34
2.2.1BOTTOM-UP APPROACH35
2.2.1.1Approach to capture market size by bottom-up analysis
(demand side)35
FIGURE 3MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH35
2.2.2TOP-DOWN APPROACH35
2.2.2.1Approach to capture market size by top-down analysis (supply side)36
FIGURE 4MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH36
2.3MARKET BREAKDOWN AND DATA TRIANGULATION37
FIGURE 5DATA TRIANGULATION37
2.4RESEARCH ASSUMPTIONS38
FIGURE 6ASSUMPTIONS FOR RESEARCH STUDY38
2.5RISK ASSESSMENT38
2.6LIMITATIONS39
3EXECUTIVE SUMMARY40
3.1GROWTH RATE ASSUMPTIONS/GROWTH FORECAST40
FIGURE 7300 MM WAFER TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD41
FIGURE 8THIN WAFER MARKET, BY WAFER SIZE,
2022–2027 (MILLION SQUARE INCHES)42
FIGURE 9MEMORY APPLICATIONS TO DOMINATE THIN WAFER MARKET BY 202742
FIGURE 10WAFER THINNING EQUIPMENT MARKET FOR LED APPLICATIONS TO GROW AT HIGHEST CAGR BETWEEN 2022 AND 202743
FIGURE 11ASIA PACIFIC ACCOUNTED FOR LARGEST SHARE OF THIN WAFER MARKET IN 202144
4PREMIUM INSIGHTS45
4.1ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN THIN WAFER MARKET45
FIGURE 12THIN WAFERS EXPECTED TO WITNESS HIGH ADOPTION RATE DURING FORECAST PERIOD45
4.2WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY45
FIGURE 13DICING TECHNOLOGY TO HOLD LARGEST MARKET SHARE DURING FORECAST PERIOD45
4.3THIN WAFER MARKET, BY APPLICATION46
FIGURE 14MARKET FOR LED EXPECTED TO GROW AT HIGHEST CAGR BETWEEN 2022 AND 202746
4.4WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY AND APPLICATION46
FIGURE 15MEMORY AND LOGIC TO BE MOST FAVORABLE APPLICATION AREAS FOR WAFER THINNING EQUIPMENT MARKET IN 202246
4.5GEOGRAPHICAL ANALYSIS OF THIN WAFER MARKET47
FIGURE 16CHINA TO EXHIBIT HIGHEST CAGR IN THIN WAFER MARKET BETWEEN 2022 AND 202747
5MARKET OVERVIEW48
5.1INTRODUCTION48
5.2MARKET DYNAMICS48
FIGURE 17THIN WAFER MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES48
5.2.1DRIVERS49
5.2.1.1Rising adoption of MEMS technology in portable health monitoring devices49
5.2.1.2Reducing size of electronic devices49
5.2.1.3Growing smartphone and consumer electronics markets49
5.2.1.4High amount of material saving49
FIGURE 18DRIVERS: IMPACT ANALYSIS50
5.2.2RESTRAINTS50
5.2.2.1Efficiency maintenance—major issue for thin wafers50
FIGURE 19RESTRAINTS: IMPACT ANALYSIS50
5.2.3OPPORTUNITIES51
5.2.3.1Expanding IC industry in China51
5.2.3.2Growing adoption of IoT and AI in automotive sector51
FIGURE 20GLOBAL IOT CONNECTIONS FORECAST BY 2025 (BILLION)52
5.2.3.3Rising adoption of portable devices52
FIGURE 21OPPORTUNITIES: IMPACT ANALYSIS52
5.2.4CHALLENGES53
5.2.4.1Volatility and susceptibility to damage caused by pressure or stress53
FIGURE 22CHALLENGES: IMPACT ANALYSIS53
5.3VALUE CHAIN ANALYSIS53
FIGURE 23VALUE CHAIN ANALYSIS: INTEGRATED DEVICE MANUFACTURERS ADD MAJOR VALUE53
5.4ECOSYSTEM/MARKET MAP55
TABLE 1PLAYERS AND THEIR ROLE IN ECOSYSTEM56
5.5TECHNOLOGY ANALYSIS57
5.5.1SILICON CARBIDE (SIC) TECHNOLOGY57
TABLE 2COMPARISON OF BENEFITS OF SIC TECHNOLOGY WITH OTHER TECHNOLOGIES57
5.6CASE STUDY ANALYSIS58
5.6.1STMICROELECTRONICS SELECTS CREE’S SILICON CARBIDE BARE AND EPITAXIAL WAFERS58
5.6.2INFINEON TECHNOLOGIES AND UMC ANNOUNCE MANUFACTURING AGREEMENT58
5.6.3GLOBALWAFERS CO., LTD. AND GLOBALFOUNDRIES ANNOUNCE PARTNERSHIP TO EXPAND SEMICONDUCTOR WAFER SUPPLY59
5.6.4VTT USES OKMETIC’S E-SOI® WAFERS FOR ITS PHOTONICS TECHNOLOGY59
5.6.5SILTERRA MALAYSIA’S NEW MANUFACTURING TECHNOLOGY FOR MEMS AND PHOTONICS DEVICES USES OKMETIC’S C-SOI WAFERS60
5.7REGULATORY LANDSCAPE60
5.8PRICING ANALYSIS61
TABLE 3SELLING PRICE OF THIN WAFER61
6THIN WAFER MARKET, BY PROCESS62
6.1INTRODUCTION63
FIGURE 24TEMPORARY BONDER AND DEBONDER MARKET SIZE63
6.2TEMPORARY BONDING & DEBONDING63
6.2.1MARKET ADHESIVES63
6.2.1.1UV-release adhesives64
6.2.1.2Thermal-release adhesives64
6.2.1.3Solvent-release adhesives64
6.3CARRIER-LESS APPROACH (TAIKO PROCESS)64

7THIN WAFER MARKET, BY WAFER SIZE65
7.1INTRODUCTION66
FIGURE 25300 MM WAFER SEGMENT TO DOMINATE MARKET BETWEEN 2022 AND 202766
TABLE 4THIN WAFER MARKET, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES)66
TABLE 5THIN WAFER MARKET, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES)67
TABLE 6THIN WAFER MARKET, BY WAFER SIZE, 2018–2021 (USD MILLION)67
TABLE 7THIN WAFER MARKET, BY WAFER SIZE, 2022–2027 (USD MILLION)67
7.2125 MM68
7.2.1ADOPTION OF LARGER DIAMETER WAFERS BY SEMICONDUCTOR MANUFACTURERS TO IMPACT SEGMENT68
TABLE 8125 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (MILLION SQUARE INCHES)68
TABLE 9125 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (MILLION SQUARE INCHES)68
TABLE 10125 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (USD MILLION)69
TABLE 11125 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (USD MILLION)69
7.3200 MM69
7.3.1DEMAND FOR 200 MM WAFERS TO WITNESS STEADY GROWTH DURING FORECAST PERIOD69
TABLE 12200 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (MILLION SQUARE INCHES)70
TABLE 13200 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (MILLION SQUARE INCHES)70
TABLE 14200 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (USD MILLION)71
TABLE 15200 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (USD MILLION)71
7.4300 MM72
7.4.1300 MM WAFER SEGMENT EXPECTED TO WITNESS FASTEST GROWTH DURING FORECAST PERIOD72
TABLE 16300 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (MILLION SQUARE INCHES)72
TABLE 17300 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (MILLION SQUARE INCHES)73
TABLE 18300 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (USD MILLION)73
TABLE 19300 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (USD MILLION)74

8THIN WAFER MARKET, BY APPLICATION75
8.1INTRODUCTION76
FIGURE 26THIN WAFER SHIPMENTS FOR LED APPLICATIONS TO GROW AT HIGHEST RATE BETWEEN 2022 AND 202776
TABLE 20THIN WAFER MARKET, BY APPLICATION, 2018–2021 (MILLION SQUARE INCHES)76
TABLE 21THIN WAFER MARKET, BY APPLICATION, 2022–2027 (MILLION SQUARE INCHES)77
FIGURE 27MEMORY TO BE LARGEST APPLICATION IN THIN WAFERS MARKET IN 202277
TABLE 22THIN WAFER MARKET, BY APPLICATION, 2018–2021 (USD MILLION)78
TABLE 23THIN WAFER MARKET, BY APPLICATION, 2022–2027 (USD MILLION)78
TABLE 24WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION)79
TABLE 25WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION)79
8.2MEMS80
8.2.1GROWTH ATTRIBUTED TO HIGH ADOPTION IN PORTABLE ELECTRONIC DEVICES80
TABLE 26THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES)80
TABLE 27THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES)80
TABLE 28THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2018–2021 (USD MILLION)81
TABLE 29THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2022–2027 (USD MILLION)81
TABLE 30WAFER THINNING EQUIPMENT MARKET FOR MEMS APPLICATIONS, BY REGION, 2018–2021 (USD MILLION)81
TABLE 31WAFER THINNING EQUIPMENT MARKET FOR MEMS APPLICATIONS, BY REGION, 2022–2027 (USD MILLION)82
8.3CIS82
8.3.1INCREASING DEMAND FOR CIS FROM AUTOMOTIVE VERTICAL EXPECTED TO DRIVE DEMAND82
TABLE 32THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES)82
TABLE 33THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES)83
TABLE 34THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2018–2021 (USD MILLION)83
TABLE 35THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2022–2027 (USD MILLION)83
TABLE 36WAFER THINNING EQUIPMENT MARKET FOR CIS APPLICATIONS, BY REGION, 2018–2021 (USD MILLION)84
TABLE 37WAFER THINNING EQUIPMENT MARKET FOR CIS APPLICATIONS, BY REGION, 2022–2027 (USD MILLION)84
8.4MEMORY84
8.4.1GROWING ADOPTION OF NAND FLASH MEMORY IN MOBILE ELECTRONICS TO DRIVE DEMAND84
TABLE 38THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES)85
TABLE 39THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES)85
TABLE 40THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2018–2021 (USD MILLION)85
TABLE 41THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2022–2027 (USD MILLION)86
TABLE 42WAFER THINNING EQUIPMENT MARKET FOR MEMORY APPLICATIONS, BY REGION, 2018–2021 (USD MILLION)86
TABLE 43WAFER THINNING EQUIPMENT MARKET FOR MEMORY APPLICATIONS, BY REGION, 2022–2027 (USD MILLION)86
8.5RF DEVICES87
8.5.1GROWING ADOPTION OF RF DEVICES IN SMARTPHONES TO PROPEL MARKET GROWTH87
TABLE 44THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES)87
TABLE 45THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES)87
TABLE 46THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2018–2021 (USD MILLION)88
TABLE 47THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2022–2027 (USD MILLION)88
TABLE 48WAFER THINNING EQUIPMENT MARKET FOR RF DEVICES, BY REGION, 2018–2021 (USD MILLION)88
TABLE 49WAFER THINNING EQUIPMENT MARKET FOR RF DEVICES, BY REGION, 2022–2027 (USD MILLION)88
8.6LED89
8.6.1INCREASING DEMAND FOR LED COMPONENTS IN HOMES AND INFRASTRUCTURE TO DRIVE SEGMENT89
TABLE 50THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES)89
TABLE 51THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES)90
TABLE 52THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2018–2021 (USD MILLION)90
TABLE 53THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2022–2027 (USD MILLION)90
TABLE 54WAFER THINNING EQUIPMENT MARKET FOR LED DEVICES, BY REGION, 2018–2021 (USD MILLION)91
TABLE 55WAFER THINNING EQUIPMENT MARKET FOR LED DEVICES, BY REGION, 2022–2027 (USD MILLION)91
8.7INTERPOSERS91
8.7.1NEED FOR ADVANCED ARCHITECTURE IN MINIATURE ELECTRONIC DEVICES TO DRIVE DEMAND91
TABLE 56THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES)92
TABLE 57THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES)92
TABLE 58THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2018–2021 (USD MILLION)92
TABLE 59THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2022–2027 (USD MILLION)93
TABLE 60WAFER THINNING EQUIPMENT MARKET FOR INTERPOSERS, BY REGION, 2018–2021 (USD MILLION)93
TABLE 61WAFER THINNING EQUIPMENT MARKET FOR INTERPOSERS, BY REGION, 2022–2027 (USD MILLION)93
8.8LOGIC94
8.8.1HIGH PENETRATION OF AFFORDABLE CLOUD COMPUTING SOLUTIONS TO DRIVE DEMAND94
TABLE 62THIN WAFER MARKET FOR LOGIC DEVICES, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES)94
TABLE 63THIN WAFER MARKET FOR LOGIC DEVICES, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES)94
TABLE 64THIN WAFER MARKET FOR LOGIC DEVICES, BY WAFER SIZE, 2018–2021 (USD MILLION)95
TABLE 65THIN WAFER MARKET FOR LOGIC DEVICES, BY WAFER SIZE, 2022–2027 (USD MILLION)95
TABLE 66WAFER THINNING EQUIPMENT MARKET LOGIC APPLICATIONS, BY REGION, 2018–2021 (USD MILLION)95
TABLE 67WAFER THINNING EQUIPMENT MARKET FOR LOGIC APPLICATIONS, BY REGION, 2022–2027 (USD MILLION)96
8.9OTHERS96
TABLE 68THIN WAFER MARKET FOR OTHER APPLICATIONS, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES)97
TABLE 69THIN WAFER MARKET FOR OTHER APPLICATIONS, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES)97
TABLE 70THIN WAFER MARKET FOR OTHER APPLICATIONS, BY WAFER SIZE, 2018–2021 (USD MILLION)97
TABLE 71THIN WAFER MARKET FOR OTHER APPLICATIONS, BY WAFER SIZE, 2022–2027 (USD MILLION)98
TABLE 72WAFER THINNING EQUIPMENT MARKET FOR OTHER APPLICATIONS, BY REGION, 2018–2021 (USD MILLION)98
TABLE 73WAFER THINNING EQUIPMENT MARKET FOR OTHER APPLICATIONS, BY REGION, 2022–2027 (USD MILLION)98
9THIN WAFER MARKET, BY TECHNOLOGY99
9.1INTRODUCTION100
FIGURE 28WAFER POLISHING EQUIPMENT MARKET TO GROW AT HIGHEST CAGR BETWEEN 2022 AND 2027100
TABLE 74WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY, 2018–2021 (USD MILLION)100
TABLE 75WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY, 2022–2027 (USD MILLION)100
9.2WAFER GRINDING101
9.2.1ATTRACTIVE FOR USE IN MINIATURIZATION OF SEMICONDUCTOR DEVICES101
TABLE 76WAFER GRINDING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION)102
TABLE 77WAFER GRINDING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION)102
TABLE 78WAFER GRINDING EQUIPMENT MARKET, BY REGION, 2018–2021 (USD MILLION)102
TABLE 79WAFER GRINDING EQUIPMENT MARKET, BY REGION, 2022–2027 (USD MILLION)103
9.3WAFER POLISHING103
9.3.1DEMAND FOR THIN WAFERS WITH SMOOTH SURFACE FOR SEAMLESS INTEGRATION TO DRIVE SEGMENT103
TABLE 80WAFER POLISHING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION)104
TABLE 81WAFER POLISHING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION)104
TABLE 82WAFER POLISHING EQUIPMENT MARKET, BY REGION, 2018–2021 (USD MILLION)104
TABLE 83WAFER POLISHING EQUIPMENT MARKET, BY REGION, 2022–2027 (USD MILLION)105
9.4WAFER DICING105
9.4.1WAFER DICING EQUIPMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD105
TABLE 84WAFER DICING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION)106
TABLE 85WAFER DICING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION)106
TABLE 86WAFER DICING EQUIPMENT MARKET, BY REGION, 2018–2021 (USD MILLION)107
TABLE 87WAFER DICING EQUIPMENT MARKET, BY REGION, 2022–2027 (USD MILLION)107
10THIN WAFER MARKET, BY GEOGRAPHY108
10.1INTRODUCTION109
FIGURE 29THIN WAFER MARKET: GEOGRAPHIC SNAPSHOT, 2022–2027109
TABLE 88THIN WAFER MARKET, BY REGION, 2018–2021 (USD MILLION)109
TABLE 89THIN WAFER MARKET, BY REGION, 2022–2027 (USD MILLION)110
TABLE 90WAFER THINNING EQUIPMENT MARKET, BY REGION, 2018–2021 (USD MILLION)110
TABLE 91WAFER THINNING EQUIPMENT MARKET, BY REGION, 2022–2027 (USD MILLION)110
10.2AMERICAS111
FIGURE 30AMERICAS: GEOGRAPHIC SNAPSHOT111
TABLE 92AMERICAS: THIN WAFER MARKET, BY COUNTRY, 2018–2021 (USD MILLION)112
TABLE 93AMERICAS: THIN WAFER MARKET, BY COUNTRY, 2022–2027 (USD MILLION)112
TABLE 94AMERICAS: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION)112
TABLE 95AMERICAS: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION)113
10.2.1US113
10.2.1.1US to lead thin wafer market in Americas during forecast period113
10.2.2CANADA114
10.2.2.1Government support to promote use of electric vehicles to drive market114
10.2.3REST OF AMERICAS114
10.2.3.1Growing demand for semiconductor devices from consumer electronics and automotive industries to fuel market growth114
10.3EMEA115
FIGURE 31EMEA: GEOGRAPHIC SNAPSHOT115
TABLE 96EMEA: THIN WAFER MARKET, BY COUNTRY, 2018–2021 (USD MILLION)116
TABLE 97EMEA: THIN WAFER MARKET, BY COUNTRY, 2022–2027 (USD MILLION)116
TABLE 98EMEA: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION)116
TABLE 99EMEA: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION)117
10.3.1UK117
10.3.1.1Increase in demand for portable medical devices to drive market117
10.3.2GERMANY117
10.3.2.1Growing adoption of MEMS sensors in automotive industry to drive market117
10.3.3FRANCE118
10.3.3.1Increased EV manufacturing to bolster market growth in France118
10.3.4REST OF EMEA118
10.3.4.1Dearth of thin wafer manufacturers ― opportunity for new investments in Rest of EMEA118
10.4ASIA PACIFIC119
FIGURE 32ASIA PACIFIC: GEOGRAPHIC SNAPSHOT119
TABLE 100ASIA PACIFIC: THIN WAFER MARKET, BY COUNTRY, 2018–2021 (USD MILLION)120
TABLE 101ASIA PACIFIC: THIN WAFER MARKET, BY COUNTRY, 2022–2027 (USD MILLION)120
TABLE 102ASIA PACIFIC: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION)120
TABLE 103ASIA PACIFIC: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION)121
10.4.1TAIWAN121
10.4.1.1Presence of several fabrication facilities and IC manufacturing firms to drive market121
10.4.2CHINA122
10.4.2.1China’s focus on achieving 70% IC self-sufficiency by 2025 to drive market122
10.4.3JAPAN123
10.4.3.1Presence of major market players and end-use industries to drive market123
10.4.4SOUTH KOREA123
10.4.4.1South Korea expected to account for largest share of Asia Pacific market during forecast period123
10.4.5REST OF ASIA PACIFIC124
10.4.5.1Growing demand for connected devices to drive market in Rest of Asia Pacific124
11COMPETITIVE LANDSCAPE125
11.1COMPETITIVE LANDSCAPE125
TABLE 104THIN WAFER MARKET: KEY GROWTH STRATEGIES ADOPTED BY COMPANIES FROM 2019 TO 2022125
11.2REVENUE ANALYSIS OF TOP FIVE COMPANIES126
FIGURE 33THREE-YEAR REVENUE ANALYSIS OF TOP FIVE PLAYERS IN THIN WAFER MARKET126
11.3MARKET SHARE ANALYSIS (2021)127
TABLE 105THIN WAFER MARKET: DEGREE OF COMPETITION127
11.4COMPANY EVALUATION MATRIX128
11.4.1STARS128
11.4.2EMERGING LEADERS128
11.4.3PERVASIVE PLAYERS129
11.4.4PARTICIPANTS129
FIGURE 34THIN WAFER MARKET, COMPANY EVALUATION MATRIX, 2021129
11.5START-UP/SME EVALUATION MATRIX130
11.5.1PROGRESSIVE COMPANIES131
11.5.2RESPONSIVE COMPANIES131
11.5.3DYNAMIC COMPANIES131
11.5.4STARTING BLOCKS131
FIGURE 35THIN WAFER MARKET, START-UP/SME EVALUATION QUADRANT, 2021132
11.6THIN WAFER MARKET: COMPANY FOOTPRINT133
TABLE 106COMPANY FOOTPRINT133
TABLE 107COMPANY WAFER SIZE FOOTPRINT134
TABLE 108COMPANY APPLICATION FOOTPRINT135
TABLE 109COMPANY REGIONAL FOOTPRINT136
11.7COMPETITIVE SITUATIONS AND TRENDS137
11.7.1PRODUCT LAUNCHES137
TABLE 110PRODUCT LAUNCHES, 2019–2022137
11.7.2DEALS137
TABLE 111DEALS, 2019–2022137
11.7.3OTHERS139
TABLE 112EXPANSION, 2019–2022139

12COMPANY PROFILES141
(Business Overview, Products Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats))*
12.1INTRODUCTION141
12.2KEY PLAYERS141
12.2.1SK SILTRON141
TABLE 113SK SILTRON: BUSINESS OVERVIEW141
FIGURE 36SK SILTRON: COMPANY SNAPSHOT142
12.2.2SHIN-ETSU CHEMICAL CO., LTD.144
TABLE 114SHIN-ETSU CHEMICAL CO., LTD.: BUSINESS OVERVIEW144
FIGURE 37SHIN-ETSU CHEMICAL CO., LTD.: COMPANY SNAPSHOT145
12.2.3SILTRONIC148
TABLE 115SILTRONIC: BUSINESS OVERVIEW148
FIGURE 38SILTRONIC: COMPANY SNAPSHOT149
12.2.4SUMCO CORPORATION152
TABLE 116SUMCO CORPORATION: BUSINESS OVERVIEW152
FIGURE 39SUMCO CORPORATION: COMPANY SNAPSHOT152
12.2.5GLOBALWAFERS CO., LTD.155
TABLE 117GLOBALWAFERS CO., LTD.: BUSINESS OVERVIEW155
FIGURE 40GLOBALWAFERS CO., LTD.: COMPANY SNAPSHOT156
12.2.6SOITEC160
TABLE 118SOITEC: BUSINESS OVERVIEW160
FIGURE 41SOITEC: COMPANY SNAPSHOT161
12.2.7SUSS MICROTEC164
TABLE 119SUSS MICROTEC: BUSINESS OVERVIEW164
FIGURE 42SUSS MICROTEC: COMPANY SNAPSHOT165
12.2.8DISCO CORPORATION169
TABLE 120DISCO CORPORATION: BUSINESS OVERVIEW169
FIGURE 43DISCO CORPORATION: COMPANY SNAPSHOT169
12.2.9OKMETIC172
TABLE 121OKMETIC: BUSINESS OVERVIEW172
12.2.103M174
TABLE 1223M: BUSINESS OVERVIEW174
FIGURE 443M: COMPANY SNAPSHOT174
12.2.11APPLIED MATERIALS176
TABLE 123APPLIED MATERIALS: BUSINESS OVERVIEW176
FIGURE 45APPLIED MATERIALS: COMPANY SNAPSHOT177
12.3OTHER COMPANIES179
12.3.1MECHATRONIC SYSTEMTECHNIK179
12.3.2SYNOVA180
12.3.3EV GROUP181
12.3.4BREWER SCIENCE182
12.3.5WAFER WORKS CORPORATION183
12.3.6ATECOM TECHNOLOGY CO., LTD.184
12.3.7SIL’TRONIX SILICON TECHNOLOGIES185
12.3.8LDK SOLAR185
12.3.9PV CRYSTALOX SOLAR PLC186
12.3.10UNIVERSITYWAFER, INC186
12.3.11SHANGHAI SIMGUI TECHNOLOGY CO., LTD187
12.3.12VIRGINIA SEMICONDUCTOR INC188
12.3.13SILICON VALLEY MICROELECTRONICS189
12.3.14WAFER WORLD INC.190
*Details on Business Overview, Products Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats) might not be captured in case of unlisted companies.
13APPENDIX191
13.1DISCUSSION GUIDE191
13.2KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL194
13.3CUSTOMIZATION OPTIONS196
13.4RELATED REPORTS196
13.5AUTHOR DETAILS197

Report Title: Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027


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