Plastics in Electronics Components: Technologies and Global Markets

 Published On: Sep, 2015 |    No of Pages: 196 |  Published By: BCC Research-JT Gabrielsen Consulting LLC Research | Format: PDF
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The  global electronic component market volume was 3.6 billion pounds in 2014. This market should reach  nearly 3.8 billion pounds in 2015 and more than 4.4 billion pounds by 2020, demonstrating a compound annual growth rate (CAGR) of 3.3% from 2015 to 2020.

This report provides:

-An overview of the global market for plastics in electronic components.
-Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020.
-Information about pricing of resins, molders of electronic components, testing agencies and requirements related to electronic components.
-Discussion of emerging and developmental technologies and applications that have the greatest commercial potential through 2020.
-Coverage of single devices such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.
-Comprehensive company profiles of major players in the industry.

INTRODUCTION

OBJECTIVES
This study focuses on the use of plastics in electronic components. It considers the wide range of thermoplastics and thermosetting polymers (including polyurethanes) that are being used in electronic components found in industrial, automotive and consumer electronics. It reviews the most recent developments in these materials that respond to the changing needs of the markets, and it analyzes the current and likely future sizes of these markets, broken down by component and by polymer type.

SCOPE AND FORMAT
This study covers all electronic components where plastics are used to a significant extent. It concentrates on components produced by injection molding, compression molding and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures.

The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and Global Markets and norms that may have significant effects on markets for electronic components, and it looks at interpolymer competition.

REASONS FOR DOING THE STUDY
Overall, plastics consumption in electronic components had been growing at rates well above those of growth in gross domestic product for many years. Electronic products have invaded virtually all areas of our personal and business lives, and their levels of sophistication continue to increase. The amount of electronics in automobile control, driver assist and infotainment systems is rising rapidly. Cloud computing is carried out on a massive scale, and now the Internet of Everything is connecting devices as well as people.

At the same time, the tendency of many personal electronics to become fashion items has reduced product life cycles, with each new product generation putting new demands – in performance and especially cost – on the materials that go into them.

In addition, the increasing visibility of electronic devices, most notably in mobile devices (smartphones and tablets), has been a key driver in pushing electronics companies to use more “environment-friendly” technologies and materials in their products. So the market is in a state of permanent flux, and regular reappraisals are called for. This report is a fully revised update of one carried out in 2012.

INTENDED AUDIENCE
-This report should be of interest to a wide audience of organizations following the development of the market for engineering thermoplastics and thermosets in electronic components. Interested parties are likely to include:
-Companies involved in the development, manufacture and supply of plastics materials for the electronics market.
-Companies involved in the development, manufacture, supply and use of passive electronic components that make incorporate plastics.
-Manufacturers and suppliers of plastics processing equipment.
-Public and private agencies involved in materials and component research.
-Academia.
-Venture capital companies and financial institutions interested in new and attractive investments.

METHODOLOGY AND INFORMATION SOURCES
Both primary and secondary information sources were used in preparing this report. A comprehensive review was undertaken of literature relating to polymers used to produce electronic components, their applications, technologies used to produce the components, markets and producers along the supply chain around the world. Included in the review was literature from manufacturers, associations and independent observers. Interviews were also carried out with various experts in the field.
Chapter- 1: INTRODUCTION - Complimentary 3 $0   
OBJECTIVES
SCOPE AND FORMAT
REASONS FOR DOING THE STUDY
INTENDED AUDIENCE
METHODOLOGY AND INFORMATION SOURCES
RELATED BCC RESEARCH REPORTS
ANALYST'S CREDENTIALS
BCC RESEARCH WEBSITE
DISCLAIMER

Chapter- 2: SUMMARY 4 $250   
Table Summary : GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF POLYMER, THROUGH 2020
Figure Summary : GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF POLYMER, 2014-2020

Chapter- 3: POLYMERS USED IN ELECTRONIC COMPONENTS 65 $3308   
OVERVIEW
TYPES OF POLYMERS
THERMOPLASTICS
THERMOSET POLYMERS

Chapter- 4: OVERVIEW OF KEY COMPONENTS, PRINTED CIRCUIT BOARDS AND ENCAPSULANTS 40 $2036   
INTRODUCTION
FOCUS OF THIS REPORT
RESIN CONSUMPTION
PRINTED CIRCUIT BOARDS
ENCAPSULANTS

Chapter- 5: MOLDED ELECTRONIC PRODUCTS 26 $1323   
OVERVIEW
BACKGROUND
POLYMERS USED
MARKET DRIVERS
CONNECTORS
SWITCHES
COIL FORMERS
RELAYS
CAPACITORS
OTHER MOLDED ELECTRONIC COMPONENTS
SUMMARY OF MARKET ESTIMATES AND FORECASTS

Chapter- 6: USES AND INDUSTRY TRENDS 12 $611   
OVERVIEW
SNAPSHOT OF THE ELECTRONIC DEVICE MARKET
COMPUTERS
ELECTRONIC DISPLAYS
PRINTERS
''ALL-IN-ONE'' MACHINES
PHONES
FAX MACHINES
SCANNERS
MOBILE ELECTRONIC DEVICES
AUTOMOTIVE MARKET

Chapter- 7: TECHNOLOGY TRENDS AND RECENT PATENTS RELATED TO ELECTRONIC COMPONENTS 13 $662   
BACKGROUND
IMPORTANCE OF MINIATURIZATION
THIN-WALLING ELECTRONIC COMPONENTS
FLEXIBLE ELECTRONICS
WEARABLE ELECTRONICS
CLOUD COMPUTING AND BIG DATA
THE INTERNET OF EVERYTHING
CHANGES IN ELECTRONIC COMPONENT MANUFACTURING THAT COULD IMPACT RESIN CHOICES
RECENT PATENTS RELATED TO THE INDUSTRY

Chapter- 8: ELECTRONIC COMPONENT INDUSTRY OVERVIEW AND PLASTICS PRODUCERS 9 $458   
TOP SEMICONDUCTOR PRODUCERS AND CUSTOMERS
MANUFACTURING AND MARKETING ASPECTS
PLASTICS PRODUCERS
POLYMER PRODUCERS ACCORDING TO MATERIAL TYPE

Chapter- 9: ENVIRONMENTAL ISSUES 6 $305   
OVERVIEW
PRINTED CIRCUIT BOARD DISPOSAL
BROMINE-FREE PRINTED CIRCUIT BOARDS
HALOGEN-FREE FLAME RETARDANTS FOR THERMOPLASTICS
RECYCLING
ELECTRONIC INDUSTRY INTERFACE

Chapter- 10: PERFORMANCE REQUIREMENTS RELATED TO ELECTRONIC COMPONENTS 6 $305   
OVERVIEW

Chapter- 11: SELECTED COMPANY PROFILES 9 $458   
ASAHI KASEI CHEMICAL
ASHLAND SPECIALTY CHEMICALS
BASF
CELANESE
COVESTRO
CYTEC INDUSTRIES INC.
DSM
DUPONT
EMS GRIVORY
EPIC RESINS
HENKEL AG
HUNTSMAN ADVANCED MATERIALS
INTERPLASTIC CORP.
KINGFA
LANXESS
MITSUBISHI ENGINEERING PLASTICS
POLYPLASTICS
SABIC INNOVATIVE PLASTICS
SOLVAY SPECIALTY POLYMERS
SUMITOMO BAKELITE
TORAY PLASTICS
VICTREX

Chapter- 12: APPENDIX: ACRONYMS 3 $153   

List of Tables

Summary Table : GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF POLYMER, THROUGH 2020
Table 1 : EXAMPLES OF STANDARD NYLONS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
Table 2 : GLOBAL STANDARD NYLON ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 3 : EXAMPLES OF POLYBUTYLENE TEREPHTHALATES USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
Table 4 : GLOBAL POLYBUTYLENE TEREPHTHALATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 5 : GLOBAL PET/PCT ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 6 : EXAMPLES OF POLYPHENYLENE SULFIDE AND POLYPHENYLENE SULFIDE BLENDS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
Table 7 : GLOBAL POLYPHENYLENE SULFIDE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 8 : GLOBAL POLYIMIDE* ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 9 : EXAMPLES OF POLYCARBONATES USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
Table 10 : GLOBAL POLYCARBONATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 11 : EXAMPLES OF POLYPHTHALAMIDE POLYMERS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
Table 12 : GLOBAL POLYPHTHALAMIDES AND HIGH-TEMPERATURE NYLONS ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 13 : EXAMPLES OF LIQUID CRYSTAL POLYMERS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
Table 14 : GLOBAL LIQUID CRYSTAL POLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 15 : GLOBAL SULFONE POLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 16 : GLOBAL POLYMER ALLOY/BLEND ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 17 : GLOBAL FLUOROPOLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 18 : EXAMPLES OF PAEK USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
Table 19 : GLOBAL POLYARYLETHERKETONE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 20 : GLOBAL THERMOPLASTIC ELECTRONIC COMPONENT MARKET BY TYPE, THROUGH 2020
Table 21 : THERMOSET PROPERTIES AND MANUFACTURING PROCESSES
Table 22 : EXAMPLES OF EPOXY RESINS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
Table 23 : GLOBAL EPOXY RESIN ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 24 : EXAMPLES OF POLYURETHANE SYSTEMS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
Table 25 : GLOBAL POLYURETHANE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 26 : EXAMPLES OF PHENOLICS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
Table 27 : GLOBAL PHENOLIC ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 28 : EXAMPLES OF UNSATURATED POLYESTER AND VINYL ESTER RESINS AND COMPOUNDS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
Table 29 : GLOBAL UNSATURATED POLYESTER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 30 : GLOBAL DIALLYL PHTHALATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 31 : GLOBAL THERMOSET ELECTRONIC COMPONENT MARKET BY TYPE, THROUGH 2020
Table 32 : IMPORTANT TECHNICAL FACTORS TO CONSIDER WHEN SELECTING PRINTED CIRCUIT BOARD SUBSTRATE MATERIALS
Table 33 : COMPARISON BETWEEN RIGID AND FLEXIBLE CIRCUIT BOARDS
Table 34 : MAJOR PRODUCERS OF RIGID AND FLEXIBLE CIRCUIT BOARDS
Table 35 : POLYMERS SUITABLE FOR PRODUCTION OF 3D-MIDS USING LDS TECHNOLOGY
Table 36 : ADVANTAGES AND DISADVANTAGES OF LDS AND TWO-COMPONENT MOLDING FOR 3D-MIDS
Table 37 : GLOBAL PRINTED CIRCUIT BOARD MARKET BY POLYMER TYPE, THROUGH 2020
Table 38 : GLOBAL PCB* MARKET BY THERMOPLASTIC TYPE, THROUGH 2020
Table 39 : GLOBAL PRINTED CIRCUIT BOARD MARKET BY THERMOSET TYPE, THROUGH 2020
Table 40 : TYPES OF ENCAPSULANT MATERIALS - ADVANTAGES AND DISADVANTAGES
Table 41 : EPOXY ENCAPSULANT FORMULATIONS
Table 42 : GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY POLYMER TYPE, THROUGH 2020
Table 43 : GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY THERMOPLASTIC TYPE, THROUGH 2020
Table 44 : GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY THERMOSET TYPE, THROUGH 2020
Table 45 : MAJOR MANUFACTURERS OF ELECTRONIC CONNECTORS
Table 46 : GLOBAL ELECTRONIC CONNECTOR MARKET BY POLYMER TYPE, THROUGH 2020
Table 47 : GLOBAL ELECTRONIC CONNECTOR MARKET BY THERMOPLASTIC TYPE, THROUGH 2020
Table 48 : GLOBAL ELECTRONIC CONNECTOR MARKET BY THERMOSET TYPE, THROUGH 2020
Table 49 : GLOBAL ELECTRONIC SWITCH MARKET BY POLYMER TYPE, THROUGH 2020
Table 50 : GLOBAL ELECTRONIC SWITCH MARKET BY THERMOPLASTIC TYPE, THROUGH 2020
Table 51 : GLOBAL ELECTRONIC COMPONENT SWITCH MARKET BY THERMOSET TYPE, THROUGH 2020
Table 52 : SELECTED MANUFACTURERS MOLDING COIL FORMERS FOR ELECTRONIC APPLICATIONS
Table 53 : GLOBAL COIL-FORMER MARKET BY POLYMER TYPE, THROUGH 2020
Table 54 : GLOBAL COIL-FORMER MARKET BY THERMOPLASTIC TYPE, THROUGH 2020
Table 55 : GLOBAL COIL-FORMER MARKET BY THERMOSET TYPE, THROUGH 2020
Table 56 : GLOBAL RELAY MARKET BY POLYMER TYPE, THROUGH 2020
Table 57 : GLOBAL RELAY MARKET BY THERMOPLASTIC TYPE, THROUGH 2020
Table 58 : GLOBAL RELAY MARKET BY THERMOSET TYPE, THROUGH 2020
Table 59 : GLOBAL CAPACITOR MARKET BY THERMOPLASTIC TYPE, THROUGH 2020
Table 60 : GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY POLYMER TYPE, THROUGH 2020
Table 61 : GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
Table 62 : GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOSET TYPE, THROUGH 2020
Table 63 : GLOBAL ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 64 : GLOBAL THERMOPLASTIC ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 65 : GLOBAL THERMOSET ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020
Table 66 : TOP GLOBAL SEMICONDUCTOR PRODUCER COMPANIES, 2014
Table 67 : TOP GLOBAL SEMICONDUCTOR CUSTOMERS, 2014
Table 68 : TRADE NAMES OF SELECTED, KEY PLASTICS USED IN ELECTRONIC COMPONENTS

List of Figures

Summary Figure : GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF POLYMER, 2014-2020    

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